Printed circuit boards (PCBs) form the backbone of modern electronics, yet the materials that give them strength and insulation often rely on hazardous chemistries. The most common substrate, FR-4, is a fiberglass-reinforced epoxy containing compounds such as bisphenol A (BPA), epichlorohydrin, and BADGE—chemicals linked to carcinogenicity, endocrine disruption, and environmental persistence. This project challenged the team to explore safer alternatives to FR-4 that maintain the demanding electrical, thermal, and mechanical performance required for electronics manufacturing.
Using a green chemistry framework, the team worked with a leading hardware developer to evaluate potential materials across three key criteria: hazard reduction, recyclability and end-of-life outcomes, and compatibility with existing PCB manufacturing processes. Performance metrics—including thermal stability, electrical insulation, mechanical strength, and chemical resistance—were assessed alongside lifecycle hazards associated with production and electronic waste.
The analysis identified three promising strategies. Bio-based epoxy thermosets derived from isosorbide could reduce reliance on petroleum feedstocks while maintaining compatibility with existing fabrication processes. Epoxy vitrimer systems introduce dynamic covalent bonds that allow repair, reshaping, and partial recycling of circuit board substrates. Finally, thermoplastic polyester PICT, particularly when reinforced with cellulose nanocrystals, offers the greatest long-term potential for circular electronics by enabling melt-processing and more conventional recycling pathways.
Together, these approaches demonstrate that safer polymer design and circular materials strategies could significantly reduce the environmental and health impacts of electronics manufacturing—while preserving the performance standards required for modern circuit boards.